Cosmic Corporation

Technology / Solution

Others

anchor

Profile for Ceramic Heater Temperature

Temperature of through-hole inside became as shown in the profile below (at soldering by PSU500)

Temperature Changes at Soldering Points (profile)

Temperature Changes at Soldering Points (profile)

How to measure the temperature (for example)

How to measure the temperature (for example)

Soldering Conditions at Measuring Temperature

Temperature of soldering tip 550°C
Melting time 0.7sec.
Heating time 0.5sec.

anchor

Dead Space

Reference Diagram for Solderable Point Range of
Automated Point Soldering Unit PSU500

Reference Diagram for Solderable Point Range ofAutomated Point Soldering Unit PSU500

Solderable points and ranges are depending on height and thickness of the terminal and surrounding parts.
For patterns that has heat loss, making them a thermal relief enables better soldering.

Thermal Relief Examples

Thermal Relief Examples

anchor

Point Soldering Unit Operational Sequence sheet

Operational Sequence of PSU500

  1. 1. Cutting solder wire with fixed amount Heater opens

    Cutting solder wire with fixed amount
    Heater opens

  2. 2. 1st down of heater (Heater will stop at the position where not touching to PCB) Solder guide down (for supplying Solder) * For ground pattern, thermal relief point, have a time for preheating before solder guide going down

    1st down of heater (Heater will stop at the position where not touching to PCB)
    Solder guide down (for supplying Solder)
    * For ground pattern, thermal relief point, have a time for preheating before solder guide going down

  3. 3. Heater closed (Melting time starts)Solder charged

    Heater closed (Melting time starts)
    Solder charged

  4. 4. Solder melts Solder guide up

    Solder melts
    Solder guide up

  5. 5. The next piece of solder is cutOpening heater and melted solder goes lead of parts,solder will spread  out  with wetting.

    The next piece of solder is cut
    Opening heater and melted solder goes lead of parts,
    solder will spread out with wetting.

  6. 6. Heater closed

    Heater closed

  7. 7. 2nd down of heater * Closing or touching to PCB (setting is available) Start for heating solder and the work

    2nd down of heater
    * Closing or touching to PCB (setting is available)
    Start for heating solder and the work

  8. 8. heating (for wetting more)

    heating
    (for wetting more)

  9. 9. Stop heating Heater opens and up

    Stop heating
    Heater opens and up

  10. 10. Soldering is completed

    Soldering is completed

anchor

How our PSU500 manages flux effectively at soldering

1. After cutting cored solder, piece of solder is falling to the heater.

1. After cutting cored solder wire, piece of solder is falling to the heater.

Covering by heater groove reduces flying out of flux and solder.

2. Flux comes out before solder melted.

2. Flux comes out before solder melted.

Flux is not shut in solder but it is pushed out from cut face of solder chip. (because solder was cut out to be a chip.) Because flux excessive expanding and flying out to be less happening and it reduces solder ball.

3. Applying “Atomized Flux”

3. Applying “Atomized Flux”

“Atomized flux” created by touching high temperature ceramic heater tip is applying to the lead and PCB. And ceramic heater tip is blocking and reducing flux for flying out. Flux needs heat more than activation temperature. Activation materials for low temperature range and high temperature range are included in flux, so flux has durative activation.

4. Wetting of solder

4. Wetting of solder

After removed oxide film and activated by flux & heat, heated & melted solder was properly wetted and extended. Heater is additionaly heating to melted and dropped down solder for wetting and expanding properly.

*In the video, distance between two heaters was opened bigger on purpose for showing solder clearly.

*Atomized stuff flying from heater is activator in flux. Flux atomized in a instant by high temperature, it becomes very fine particle and will be applied to the PCB and lead.

As described above, heat-retaining solder is properly wetted and extended to the place after atomized flux applied, like this, ideal soldering is done.